| Title: | Cell surface-engineered yeast displaying a histidine oligopeptide (hexa-His) has enhanced adsorption of and tolerance to heavy metal ions |
| Author(s): | Kuroda K; Shibasaki S; Ueda M; Tanaka A; |
| Address: | "Department of Synthetic Chemistry and Biological Chemistry, Graduate School of Engineering, Kyoto University, Japan" |
| Journal Title: | Appl Microbiol Biotechnol |
| ISSN/ISBN: | 0175-7598 (Print) 0175-7598 (Linking) |
| Abstract: | "A histidine oligopeptide (hexa-His) with the ability to chelate divalent heavy metal ions was displayed on the yeast cell surface for the purpose of enhanced adsorption of heavy metal ions. We genetically fused a hexa-His-encoding gene with the gene encoding the C-terminal half of alpha-agglutinin that includes a glycosylphosphatidylinositol anchor attachment signal sequence and attached the hexa-His peptide on the cell wall of Saccharomyces cerevisiae. This surface-engineered yeast adsorbed three to eight times more copper ions than the parent strain and was more resistant to copper (4 mM) than the parent (below 1 mM at pH 7.8). It was possible to recover about a half of the copper ions adsorbed by whole cells with EDTA treatment without disintegrating the cells. Thus, we succeeded in constructing a novel yeast cell with both tolerance to toxic contaminants and enhanced adsorption of metal ions onto the cell surface" |
| Keywords: | "Adsorption Artificial Gene Fusion Cell Membrane/metabolism Chelating Agents/metabolism Copper/metabolism/toxicity Genetic Engineering Genetic Vectors Mating Factor Metals, Heavy/*metabolism/toxicity Oligopeptides/genetics/*metabolism Peptides/genetics/met;" |
| Notes: | "MedlineKuroda, K Shibasaki, S Ueda, M Tanaka, A eng Research Support, Non-U.S. Gov't Germany 2002/01/10 Appl Microbiol Biotechnol. 2001 Dec; 57(5-6):697-701. doi: 10.1007/s002530100813" |
