| Title: | "Effect of Synthetic Low-Odor Thiol-Based Hardeners Containing Hydroxyl and Methyl Groups on the Curing Behavior, Thermal, and Mechanical Properties of Epoxy Resins" |
| Author(s): | Kim YH; Baek JJ; Chang KC; Park BS; Koh WG; Shin G; |
| Address: | "Green and Sustainable Materials R&D Department, Research Institute of Clean Manufacturing System, Korea Institute of Industrials Technology (KITECH), Yangdaegiro-gil 89, Ipjang-myeon, Cheonan-si 31056, Republic of Korea. Department of Chemical and Biomolecular Engineering, Yonsei University, Yonsei-ro 50, Seodaemun-gu, Seoul 03722, Republic of Korea" |
| ISSN/ISBN: | 2073-4360 (Electronic) 2073-4360 (Linking) |
| Abstract: | "A novel thiol-functionalized polysilsesqioxane containing hydroxyl and methyl groups was synthesized using a simple acid-catalyzed sol-gel method to develop an epoxy hardener with low odor, low volatile organic compound (VOC) emissions, and fast curing at low temperatures. The synthesized thiol-based hardeners were characterized using Fourier transform infrared spectroscopy, nuclear magnetic resonance, thermogravimetric analysis (TGA), and gel permeation chromatography and compared with commercially available hardeners in terms of odor intensity and VOC emissions using the air dilution olfaction method and VOC analysis. The curing behavior and thermal and mechanical properties of the epoxy compounds prepared with the synthesized thiol-based hardeners were also evaluated. The results showed that synthetic thiol-based hardeners containing methyl and hydroxyl groups initiated the curing reaction of epoxy compounds at 53 degrees C and 45 degrees C, respectively. In contrast, commercial thiol-based hardeners initiated the curing reaction at 67 degrees C. Additionally, epoxy compounds with methyl-containing synthetic thiol-based hardeners exhibited higher TGA at a 5% weight loss temperature (>50 degrees C) and lap shear strength (20%) than those of the epoxy compounds with commercial thiol-based hardeners" |
| Keywords: | air dilution olfaction method epoxy resin low volatile organic compound (VOC) polysilsesquioxane backbone thiol-based hardener; |
| Notes: | "PubMed-not-MEDLINEKim, Young-Hun Baek, Jeong Ju Chang, Ki Cheol Park, Baek Soo Koh, Won-Gun Shin, Gyojic eng KITECH EO-23-0004/Korea Institute of Industrials Technology (KITECH)/ Switzerland 2023/07/14 Polymers (Basel). 2023 Jul 4; 15(13):2947. doi: 10.3390/polym15132947" |
